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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Project

IEC 2326-3-1: Printed boards - Part 3: Rigid single and double-sided printed boards with interlayer connections - Section 1: Capability detail specification - Performance level A, B and C

Begin

1996-10-04

Planned document number

IEC 52/677/CD

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

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Economic benefits

DIN SPEC

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Terminology

Hydrogen Technologies Standards form the basic framework for market ramp-up