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Project

IEC 191-6: General rules for TSOP (Thin Small Outline Package) Type II

Begin

1997-04-04

Planned document number

IEC 47D/170/CDV

Responsible national committee

DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente  

Contact

Dr.

Konstantin Petridis

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-443

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