Project
Proposed new package outline - 13 Pin full size Multimedia Card (MMC) Outline MMCplus 32×24×1,4 mm (Intended to become IEC 60191-2/F67, if approved)
Begin
2006-11-24
Planned document number
IEC 47D/676/NP
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices