• Hydrogen Technologies Standards form the basic framework for market ramp-up

    More information
  • Climate change Standards and specifications support climate targets

    More information
  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

    More information
Project

Proposal of USNC: Proposed new package outline - 13 Pin reduced size MultiMediaCard (MMC) outline MMCmobile 18×24×1,4 mm (Intended to become IEC 60191-2/F65, if approved)

Begin

2006-11-24

Planned document number

IEC 47D/674/NP

Responsible national committee

DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente  

Responsible international committee

IEC/SC 47D - Mechanical standardization for semiconductor devices  

Contact

Dr.

Konstantin Petridis

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-443

Send message to contact