Project
IEC 60068-2-83 Ed.1: Environmental Testing - Part 2-83: Tests-test Tf: Solderability testing of electronic components forsurface mounting devices (SMD) by the wetting balance method using solder paste
Begin
2009-01-30
Planned document number
IEC 91/903/CDV
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
