Project
IEC 191-5: Mechanical standardization of semiconductor devices - Part 5: Recommendations applaying to integrated circuit packages using tape automated bonding (TAB)
Planned document number
IEC 47D/107/FDIS
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices