CEN/CLC/WS MADRAS
Advanced materials and processing in organic electronics

The planned Workshop is applicable to hybridization and injection moulding of rigid control units on in-mould flexible devices process, it establishes best practices for the printing of plastronic devices taking into account the reproducibility, yield, functionality and cost of the In Mould Electronics processing. The purpose of the planned CEN/ Workshop Agreement(s) related In Mould Electronics is to develop two CWA’s., namely: “Injection moulding on hibridized rigic control units on flexible substrates” Scope: - Establish best practices for hybridization and injection moulding of rigid control units on in-mould flexible devices, in the case of study, an in-mould battery-free geolocation tag, a FR4-based control unit which has the function of enabling energy harvesting and communication of dedicated printed antennas, is directly hybridised on a flexible substrate which is ultimately integrated in a plastic piece through injection moulding. Procedures for the accurate attachment, alignment of the control unit on substrate with the injection mould and for reliable plastic over-moulding process are defined. Reproducibility, yield, and cost-effectiveness are evaluated. “Integration of PI-based flexible electronics on conformable plastic subtsrate” Scope: - Establish a common requirement to integrate a device stack fabricated on PI carrier onto a plastic substrate suitable for in-mould processing as polycarbonate (PC), using a thermoplastic polyurethane (TPU) as intermediate layer. The adhesion of a TPU interlayer enables to overcome the poor stretchability and poor adhesion of PI with most polymers. The purpose of the planned CEN/ Workshop Agreement(s) related design of antennas is to develop a CWA, namely: “Design rules for simulations of in-mould antennas” Scope: - Establish best practices on the design of printed antennas (UHF and UWB) by simulation considering the presence of a TPU layer. Performance and dimensions of the antennas are linked to the dielectric permittivity and the thickness of the used substrate and superstrate. Therefore, any material used for over-moulding should be considered in the simulation for an accurate antenna design.

National mirror committee of CEN/CLC/WS MADRAS