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Standards [CURRENT]

DIN EN 60749-14
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003); German version EN 60749-14:2003

Title (German)

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 14: Festigkeit der Bauelementeanschlüsse (Unversehrtheit der Anschlüsse) (IEC 60749-14:2003); Deutsche Fassung EN 60749-14:2003

Document: references other documents

Responsible national committee

DKE/K 631 - Halbleiterbauelemente  

Responsible international committee

IEC/TC 47 - Semiconductor devices  

Edition 2004-07
Original language German
Price from 91.80 €
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Table of contents

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