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Standards [CURRENT]

NF C96-022-22 ; NF EN 60749-22:2003-11-01
Semiconductor devices - Mechanical and climatic test methods - Part 22: bond strength

Title (German)

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 22: kontaktfestigkeit (Bond strength)

Edition 2003-11-01
Original language French
Price from 105.40 €
Table of contents