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Standards [CURRENT]

NF C96-022-19 ; NF EN 60749-19:2003-08-01
Semiconductor devices - Mechanical and climatic test methods - Part 19: die shear strength

Title (German)

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 19: prüfung der Chip-Bondfestigkeit

Edition 2003-08-01
Original language French
Price from 56.00 €
Table of contents