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Hydrogen Technologies Standards form the basic framework for market ramp-up
More information
Climate change Standards and specifications support climate targets
More information
Smart Farming Standards and specifications are drivers for the digitalization of agriculture
More information

Standards [CURRENT]

OEVE/OENORM EN 60191-6-5
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001)

Title (German)

Mechanische Normung von Halbleiterbauelementen - Teil 6-5: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Feinraster-Ball-Grid-Arrays (FBGA) (IEC 60191-6-5:2001)

Edition 2002-07-01

Original language German

Price from 100.28 €

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Terminology

Hydrogen Technologies Standards form the basic framework for market ramp-up

Climate change Standards and specifications support climate targets

Smart Farming Standards and specifications are drivers for the digitalization of agriculture

OEVE/OENORM EN 60191-6-5 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001)

Want to learn more?

OEVE/OENORM EN 60191-6-5
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001)