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Standards [CURRENT]

DIN EN 60191-6-8
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001

Title (German)

Mechanische Normung von Halbleiterbauelementen - Teil 6-8: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen; Konstruktionsleitfaden für Glas-Keramik-Quad-Flatpack (G-QFP); (IEC 60191-6-8:2001); Deutsche Fassung EN 60191-6-8:2001

Document: references other documents

Document: referenced in other documents

Responsible national committee

DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente

Responsible international committee

IEC/SC 47D - Mechanical standardization for semiconductor devices

Edition 2002-05

Original language German

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