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Standards [CURRENT]

DIN EN IEC 61189-2-803
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (IEC 61189-2-803:2023); German version EN IEC 61189-2-803:2023

Title (German)

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-803: Prüfverfahren für die Z-Achsen-Ausdehnung von Basismaterialien und Leiterplatten (IEC 61189-2-803:2023); Deutsche Fassung EN IEC 61189-2-803:2023

Document: references other documents

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Edition 2024-08
Original language German
Price from 63.80 €
Order from DIN Media
Table of contents

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