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Standards [CURRENT]

DIN EN IEC 63251 ; VDE 0885-201:2024-07
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress (IEC 63251:2023); German version EN IEC 63251:2023

Title (German)

Prüfverfahren für mechanische Eigenschaften von elektrisch-optischen Leiterplatten unter Wärmebeanspruchung (IEC 63251:2023); Deutsche Fassung EN IEC 63251:2023

Document: references other documents

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Edition 2024-07
Original language German
Price from 59.63 €
Order from DIN Media
Table of contents

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