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Standards [CURRENT]

DIN 50003
Adhesive bondings in electronic applications - Determination of thermal conductivity of materials for heat dissipation

Title (German)

Klebungen in elektronischen Anwendungen - Bestimmung der Wärmeleitfähigkeit von Materialien zur Wärmeableitung

Responsible national committee

NA 062-10-03 AA - Adhesive bondings in electronic applications  

Edition 2024-06
Original language German
Price from 49.20 €
Table of contents

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Dr.

Nicole Kroll

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