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Hydrogen Technologies Standards form the basic framework for market ramp-up
More information
Climate change Standards and specifications support climate targets
More information
Smart Farming Standards and specifications are drivers for the digitalization of agriculture
More information

Standards [CURRENT]

NF C93-780-2-51 ; NF EN IEC 61249-2-51:2023-06-16
Materials for printed boards and other interconnecting structures - Part 2-51 : reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad

Title (German)

Werkstoffe für Leiterplatten und andere Verbindungsstrukturen - Teil 2-51 : Kaschierte und unkaschierte verstärkte Basismaterialien - Basismaterial als Chipträger, nicht kaschiert

Edition 2023-06-16

Original language French

Price from 90.10 €

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Terminology

Hydrogen Technologies Standards form the basic framework for market ramp-up

Climate change Standards and specifications support climate targets

Smart Farming Standards and specifications are drivers for the digitalization of agriculture

NF C93-780-2-51 ; NF EN IEC 61249-2-51:2023-06-16 Materials for printed boards and other interconnecting structures - Part 2-51 : reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad

Want to learn more?

NF C93-780-2-51 ; NF EN IEC 61249-2-51:2023-06-16
Materials for printed boards and other interconnecting structures - Part 2-51 : reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad