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Standards [CURRENT]

DIN EN IEC 60749-37
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2022); German version EN IEC 60749-37:2022

Title (German)

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 37: Prüfverfahren Fall der Leiterplatte unter Verwendung eines Beschleunigungs-Messgerätes (IEC 60749-37:2022); Deutsche Fassung EN IEC 60749-37:2022

Responsible national committee

DKE/K 631 - Halbleiterbauelemente  

Edition 2023-12
Original language German
Price from 106.30 €
Order from DIN Media
Table of contents

Contact

Elena Rongen

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