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Standards [CURRENT]

DIN EN IEC 60749-20
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020); German version EN IEC 60749-20:2020

Title (German)

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20: Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente (SMD) gegenüber der kombinierten Beanspruchung von Feuchte und Lötwärme (IEC 60749-20:2020); Deutsche Fassung EN IEC 60749-20:2020

Document: references other documents

Responsible national committee

DKE/K 631 - Halbleiterbauelemente  

Edition 2023-07
Original language German
Price from 117.70 €
Order from DIN Media
Table of contents

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