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Standards [CURRENT]

DIN EN IEC 62878-2-602
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 62878-2-602:2021); German version EN IEC 62878-2-602:2021

Title (German)

Montageverfahren für eingebettete Bauteile - Teil 2-602: Leitfaden für gestapelte Elektronikmodule - Verfahren zur Beurteilung der elektrischen Verbindungsfähigkeit zwischen den Modulen (IEC 62878-2-602:2021); Deutsche Fassung EN IEC 62878-2-602:2021

Document: references other documents

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Edition 2022-08
Original language German
Price from 85.30 €
Order from DIN Media
Table of contents

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