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Standards [CURRENT]

DIN EN IEC 60749-15
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020); German version EN IEC 60749-15:2020

Title (German)

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 15: Beständigkeit gegen Löttemperatur bei Bauelementen zur Durchsteckmontage (IEC 60749-15:2020); Deutsche Fassung EN IEC 60749-15:2020

Document: references other documents

Responsible national committee

DKE/K 631 - Halbleiterbauelemente  

Edition 2022-05
Original language German
Price from 77.90 €
Order from DIN Media
Table of contents

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