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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Standards [CURRENT]

BS IEC 62047-38
Semiconductor devices. Micro-electromechanical devices. Test method for adhesion strength of metal powder paste in MEMS interconnection

Edition 2021-07-07

Original language English

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Hydrogen Technologies Standards form the basic framework for market ramp-up

Climate change Standards and specifications support climate targets

Smart Farming Standards and specifications are drivers for the digitalization of agriculture

BS IEC 62047-38 Semiconductor devices. Micro-electromechanical devices. Test method for adhesion strength of metal powder paste in MEMS interconnection

Want to learn more?

BS IEC 62047-38
Semiconductor devices. Micro-electromechanical devices. Test method for adhesion strength of metal powder paste in MEMS interconnection