DIN EN 60749-6
Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature (IEC 60749-6:2017); German version EN 60749-6:2017
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 6: Lagerung bei hoher Temperatur (IEC 60749-6:2017); Deutsche Fassung EN 60749-6:2017
Overview
The suitability of semiconductor components for different applications also depends on the climatic and mechanical environmental influences to which these components are exposed. The DIN EN 60749 series of standards contains a large number of different test procedures for this purpose. This part of the DIN EN 60749 series of standards describes a test procedure to determine the effect of elevated temperature on all electronic semiconductor components when they are stored without electrical stress. This test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure methods and time-to-failure of solid state electronic devices, including non-volatile memory devices (data-retention failure mechanisms). The responsible committee is DKE/K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
