Overview

There are two main sources of conducted electromagnetic emissions from integrated circuits (ICs): - conducted emissions from power supply connections and reference ground structures; - conducted emissions from input/output (I/O) connections. The ICEM-CE model for simulating the behavior of integrated circuits with respect to electromagnetic emissions described in this document takes these two types of causation into account in a single approach. This document describes macro models of integrated circuits (IC) for simulating conducted electromagnetic emissions on a printed circuit board. This modeling is generally referred to as modeling the EMC properties of integrated circuits - conducted emission (ICEM-CE; Integrated Circuit Emission Model - Conducted Emission). The ICEM-CE model is also used to model a chip circuit, a functional block and a programmable module (IP). The ICEM-CE model can be used to model both analog and digital ICs. The standard defines the structures and components of macro modeling for the simulation of electromagnetic interference, taking into account the internal activities of integrated circuits. This standard consists of two parts: the first part contains the electrical description of the elements of the ICEM-CE model together with the specific requirements for the information; - the second part describes a universal data exchange format, which is referred to as CEML and is based on XML. This format allows encoding the ICEM-CE in a more useable and generic form for simulating the conducted emissions. Compared to DIN EN 62433-2:2010, an XML-based exchange format has been added to represent the model. In addition, the document is included in the VDE regulations. The responsible committee is DKE/K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.

Document: references other documents

Responsible national committee

DKE/K 631 - Halbleiterbauelemente