DIN EN 62435-5
; VDE 0884-135-5:2017-10
Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices (IEC 62435-5:2017); German version EN 62435-5:2017
Elektronische Bauteile - Langzeitlagerung elektronischer Halbleiterbauelemente - Teil 5: Chip- und Wafererzeugnisse (IEC 62435-5:2017); Deutsche Fassung EN 62435-5:2017
Overview
The economic service life of an electronic component is very short compared to the service life of industrial equipment, the service life of power generation and distribution applications or in transportation. Due to the diverse application of electronics in all areas and the rapid technical development, the obsolescence of electronic components, especially integrated circuits, has become increasingly important in recent years. In most cases, the solution to an emerging obsolescence problem is to systematically store the components. The technical risks of this solution are largely low a priori. However, it requires perfect control of the implemented process and especially of the storage conditions, whereby this solution becomes critical when long-term storage occurs. Long-term storage presupposes that components are stored for a number of years in a storage facility that cannot be interrupted. It is essential that the components are usable after storage. Particular attention shall therefore be paid to the storage media that exist around the components, together with the local environmental conditions. The application of the procedure proposed in this series of standards in no way guarantees that the stored components will be in perfect working order at the end of storage. It is only a means of minimizing potential and probable degradation factors, in particular humidity, electrostatic fields, ultraviolet light, large temperature fluctuations, air pollution and outgassing. This part of DIN EN 62435 (VDE 0847-35) covers chip and wafer products and includes the special storage organization and the conditions for individual bare chips and partial wafers or entire wafers with chips, which then also includes chips with additional structures such as redistribution layers, solder balls as well as solder bumps and other metallization. It also contains the special requirements for the primary packaging of chips or wafers during handling. The responsible committee is DKE/K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
