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Standards [CURRENT]

UNE-EN 60191-6-4
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (Endorsed by AENOR in October of 2003.)

Edition 2003-10-01
Original language English
Price from 67.40 €
Table of contents