Overview

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. It contains the types of content of the IEC 61189-5 series, as well as guidance documents and handbooks for printed board assemblies. This part of IEC 61189 describes test methods for the evaluation of assembled printed circuit boards and materials used in the manufacture of electronic assemblies. The procedures are self-contained with sufficient detail and description to achieve uniformity and reproducibility in the procedures and test methodology. IEC 61189 refers both to test methods for bare and assembled printed circuit boards and to test methods for the materials used or to methods for determining the resistance of components, regardless of the respective manufacturing process. The standard is divided into individual parts containing information for the designer, test engineer or technician. Each part deals with a specific focus. The methods are grouped according to their application and numbered in the order in which they have been developed and approved. In some cases, test methods developed by other technical committees (for example, TC 104) have been reproduced from existing IEC standards in order to provide the reader with a comprehensive selection of test methods. Where this is the case, reference is made to this in the relevant test method. If the test method is reproduced with minor modifications, then these modified clauses are indicated. TC 91 has decided to merge the contents of IEC 61189-5 and IEC 61189-6 into one series of documents as follows: IEC 61189-5-1 - " Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies" IEC 61189-5-2:2015 - " Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies" IEC 61189-5-3: 2015 – " Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies" IEC 61189-5-4:2015 – " Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies" IEC 61189-5-501 - " Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes" IEC 61189-5-502 - " Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies" IEC 61189-5-503 - " Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards" IEC 61189-5-504 - " Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)". The tests listed in this standard are schematically divided into groups. P stands for procedures for the preparation / conditioning of test specimens, V for visual tests, D for dimensional tests, C for chemical test procedures, M for mechanical test procedures, E for electrical test procedures, N for environmental test procedures and X for other test procedures including process control tests for the assembly process. To facilitate reference to the tests, to maintain consistency of presentation and to allow for future expansion of the system, each test is identified by a number (assigned in the order in which it is prepared) which is added to the preceding code letter for the group (group code) to which the test belongs. The numbers of the test procedures have no meaning with regard to the final test sequence. This is defined in the corresponding specification that requires the procedure to be carried out. The corresponding specification also describes acceptance/rejection criteria in most cases. The letter-number combinations are used for reference in the corresponding specifications. For example, "5-2C01" refers to the first chemical test method described in IEC 61189-5-2. In short, in this example, 5-2 is the number of the part of IEC 61189, C is the group of test methods and 01 is the number of the test method. A list of all the test methods contained in the above documents can be found in Annex A. This annex will be reissued whenever new tests are introduced. The responsible committee is DKE/K 682 "Aufbau- und Verbindungstechnik für elektronische Baugruppen" ("Packaging and connection technology for electronic assemblies") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen