Overview

This Part 5-2 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. IEC 61189 relates to test methods for materials or component robustness for printed board assemblies, irrespective of their method of manufacture. The standard is divided into separate parts, covering information for the designer, the test methodology engineer or technician. Each part has a specific focus. The methods are grouped according to their application and numbered sequentially as they are developed and released. Tis part of IEC 61189 contains test methods for evaluating robustness of materials or component for printed board assemblies. The methods are self-contained, with sufficient detail and description so as to achieve uniformity and reproducibility in the procedures and test methodologies. The tests shown in this standard are grouped according to the following principles: - P: preparation/conditioning methods - V. visual test methods - D: dimensional test methods C: chemical test methods - mechanical test methods - E: electrical test methods N: environmental test methods X: miscellaneous test methods To facilitate reference to the tests, to retain consistency of presentation, and to provide for future expansion, each test is identified by a number (assigned sequentially) added to the prefix (group code) letter showing the group to which the test method belongs. The test method numbers have no significance with respect to an eventual test sequence; that responsibility rests with the relevant specification that calls for the method being performed. The relevant specification, in most instances, also describes pass/fail criteria. The third clause deals with the topics accuracy, precision and resolution. Errors and uncertainties are inherent in all measurement processes. The information given enables valid estimates of the amount of error and uncertainty to be taken into account. The test data serve a number of purposes which include monitoring of a process, enhancing of confidence in quality conformance, arbitration between customer and supplier. In any of these circumstances, it is essential that confidence can be placed upon the test data in terms of accuracy (calibration of the test instruments and/or system), precision (the repeatability and uncertainty of the measurement, and resolution (suitability of the instrument and or test system). Another clause deals with chemical test methods and deals with the corrosion by flux, the determination of the acid value of liquid soldering flux (potentiometric and visual titration methods), the determination of halides in fluxes (silver chromate method), quantitative determination of halide content in fluxes (chloride and bromide), qualitative analysis of fluorides and fluxes by spot test. Other topics are the quantitative determination of fluoride concentration in fluxes, the specific gravity and flux-induced corrosion (copper mirror method). In the fifth clause, miscellaneous test methods, tests for determination of liquid flux activity (wetting balance method), spread test of liquid or extracted solder flux (on solder pastes and extracted solder fluxes from solder past and extracted cored wires or preforms) and the tackiness of flux residues after drying. The responsible committee is DKE/K 682 "Montageverfahren für elektronische Baugruppen" ("Electronics assembly technology") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.

Document: references other documents

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen