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Standards [CURRENT]

NF C96-050-18 ; NF EN 62047-18:2014-02-28
Semiconductor devices - Micro-electromechanical devices - Part 18: bend testing methods of thin film materials

Title (German)

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 18: Biegeprüfverfahren für Dünnschichtwerkstoffe

Edition 2014-02-28
Original language French
Price from 90.10 €
Table of contents