Overview

The main structural material for microsystem components, micro-machines, etcetera, has special features, such as a few micron meter size, material fabrication by deposition and nonmechanical machining test components including photolithography. So it is necessary to take into account possible particular conditions for the thermal behaviour of these components and to apply special procedures for the material test. This document specifies the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric, etcetera) microelectro-mechanical system (MEMS) materials with length between 0,1 mm and 1 mm and width between 10 µm and 1 mm and thickness between 0,1 µm and 1 mm, which are main structural materials used for MEMS, micromachines and others. This test method is applicable for the CLTE measurement in the temperature range from room temperature to 30 % of a material's melting temperature. This document also specifies the essential requirements for the micro test piece to be used and their handling, the test equipment, the test procedure and the test protocol. The annexes give examples of a test setup and a micro test piece for the out-of-plane test method and data analysis for the in-plane and out-of-planes test pieces. The responsible Committee is DKE/UK 631.1 "Einzel-Halbleiterbauelemente" ("Discrete semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.

Document: references other documents

Responsible national committee

DKE/K 631 - Halbleiterbauelemente