Overview

This part of IEC 61182 provides the information on the manufacturing requirements used for fabricating printed boards. This standard specifies the XML schema details, defined in the generic standard IEC 61182-2 and some of the sectional standards that are required to accomplish the focused tasks. When other standards are invoked, their requirements become a mandatory part of the fabrication details as defined in the IEC 61182-2. IEC 61182-2 contains all the requirements necessary to build an electronic product. The cardinality indicated in the IEC 61182-2 may be superseded by a restriction of an attribute (enumerated string ID) or indication of a requirement that is noted as being optional in the generic standard. However, this standard renders the requirement mandatory based on the supply chain communication need. The requirements according to IEC 61182-2 represent a binding component of this standard. The general details include, in particular, design data, printed board fabrication, assembly and testing. The XML schema according to IEC 61182-2 consists of four main functions, each having several children elements which then become new parent elements. Some of these main elements and their associated new parents are defined in other sectional specifications, the requirements of these standards as described in this standard also being a binding component of the standard for printed board fabrication taking into consideration specified restrictions. All of these standards and the elements defined in them each have a special function or task and, although they can occasionally be used as independent standards, form an important supplement to the requirements for the description of printed board fabrication. Therefore the following clauses contain all requirements for the three types of printed board fabrication files supported by the basic principles of IEC 61182-2. Correspondingly, the information exchange for the specific purpose of printed board fabrication is only possible when all XML instances are properly prepared for this purpose. "Shall", the emphatic form of the verb, is always used in this standard when a requirement shall represent a binding provision. Deviations from a "shall" requirement are not permitted and conformity tests are required in order to verify that the XML instances correspond to the W3C regulations and this standard. Syntax and semantics shall be verified with the XML schema. For this purpose, any appropriate software aid can be used which requires the user to correct imprecise statements or incorrect information. The terms "should" and "may" are always used when it is necessary to state a non-binding provision. The term "will" is used to represent the explanation of a purpose. The terms in accordance with IEC 60194 are applicable for the use of this document. The data, that is intelligent information that may be used directly by machine in order to accomplish a particular manufacturing event, the drawings, that is hard copy or un-intelligent documentation (for example, PDF) to which all formatting criteria apply, the printed circuit board, PCB, that is a composite of organic and inorganic material with external and internal wiring allowing electronic components to be mechanically supported and electrically connected, are also introduced in the clause "Terms and definitions". The supplier is an organization or company responsible for providing the goods and/or services required to produce an electronic product which includes physical items as well as intellectual/software characteristics and is documented as either user procurement, supplier data or contractual agreements. The user is an individual, organization, company or agency responsible for the procurement of electrical/electronic hardware, and having the authority to define the class of equipment and any variation or restrictions (that is the originator/custodian of the contract detailing these requirements). The via opening in the dielectric layer(s) through which a conductor passes upwards or downwards to subsequent chip or package conductive layers for electrical interconnections or for heat transfer. The included Table 1 - Function relationship of an IEC 61182-2-2 fabrication file, includes the main functions to be dealt with in this standard. The descriptions refer to the corresponding printed board fabrication processes. There are fifteen (15) special functions which may be defined by using of XML elements and the resulting XML instances. The table provides the relationships of the requirements for different elements and characteristics within the descriptions for a certain process. The information included in the clause "General rules" explains the rules used when describing the printed board characteristics in order to meet the requirements for printed board fabrication. These rules shall correspond with the manufacturer's need to understand customer requirements. If necessary, additional requirements are provided for reasons of precision. The attributes and rules described in IEC 61182-2 are required. If necessary, the descriptions or definitions of the units, attributes or characteristics are explicitly expressed in accordance with their specification in IEC 61182-2 in order to clearly define the binding descriptions. In the clause "Overview", primarily file content descriptions, logistic descriptions, file history descriptions, BOM (board fabrication materials), AVL (board material suppliers), documentation layers, design for excellence (Dfx) analysis, miscellaneous image layers, packages and land patterns, solder mask and legend layers, drilling and routing (tooling) layers, net list, outer conductive layers, inner conductive layers, and board construction are explained. In order to assist the users of this standard, all the applicable XML schema elements that apply to the board fabrication function are listed in Annex A. The list is grouped by topics and shows the absolute path for the elements that pertain to the focus of this standard. If the parent element is not present no children are considered in the implementation either. However, all attributes identified for a particular element follow the cardinality of the IEC 61182-2, unless a restriction is stated in this standard. The responsible committee is K 682 "Montageverfahren für elektronische Baugruppen" ("Electronics assembly technology") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.

Document: references other documents

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen