DIN EN 60749-27
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 60749-27:2006 + A1:2012); German version EN 60749-27:2006 + A1:2012
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 27: Prüfung der Empfindlichkeit gegen elektrostatische Entladungen (ESD) - Machine Model (MM) (IEC 60749-27:2006 + A1:2012); Deutsche Fassung EN 60749-27:2006 + A1:2012
Overview
Electrostatic discharge can easily cause changes on the fine structures which are common on semiconductor devices and thus result in permanent impairment of functionality of the devices. The DIN EN 60749 "Semiconductor devices - Mechanical and climatic test methods" standard series contains several tests for electrostatic discharge sensitivity testing of semiconductor devices: Part 26 of the standard series specifies the Human Body MOdel (HBM) and Part 28 specifies the Charge Device Model (CDM). This part of DIN EN 60749 specifies a standard procedure for testing and classifying semiconductor devices according to their susceptibility to damage or degradation by exposure to a defined machine model (MM) electrostatic discharge (ESD). This procedure may be used as an alternative test method to the human body model ESD test method. The objective is to provide reliable, repeatable ESD test results so that accurate classifications can be performed. This test method is applicable to all semiconductor devices and is classified as destructive. The amendment to IEC 60749-27 incorporated into this new edition contains specifications regarding the ringing of the waveform and the associated peak current values. The responsible committee is K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
