DIN EN 61837-1
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines (IEC 61837-1:2012); German version EN 61837-1:2012
Oberflächenmontierbare piezoelektrische Bauteile zur Frequenzstabilisierung und -selektion - Norm-Gehäusemaße und Anschlüsse - Teil 1: Kunststoffgehäuse (IEC 61837-1:2012); Deutsche Fassung EN 61837-1:2012
Overview
Within the framework of regular reviewing standards in the field of piezoelectric devices for frequency control and selection, the previous standard DIN EN 61837-1 from 1999 has been revised. The document is based on IEC 61240 and deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in plastic moulded enclosures. All clauses and table contents of the standard have been completely revised and updated. Significant clauses of the standard deal with the configuration of enclosures, designation of types, plastic moulded enclosure dimensions, lead connections and designation of plastic moulded enclosures. The enclosures are made of plastic moulded materials with the terminal leads based on the descriptive designation system for semiconductors, devices package. The configuration symbol is DCC (dual chip carrier). The designation of types is shown in four parts as follows: configuration symbol of enclosures (DCC), the structure of terminal leads (J: leaded type), the number of terminal leads and the two digit serial number. The dimensions in this standard apply to all the completed SMD-devices for frequency control and selection. Only those dimensions are given which meet the requirements of IEC 61240. Recommendations for the lead connections of all completed SMD-devices for frequency control and selection are given in the included sheets. Lead connections shall always be given in the detail specification. Table 1 - Designation of plastic moulded enclosures, gives the types DCC-J4/01, DCC-J4/02, DCC-J4/03, DCC-J4/04, DCC-J4/05, DCC-J4/06, DCC-J4/07, DCC-J4/08 of the plastic enclosures outlined in the specification sheets. The following modifications have been made with respect to DIN EN 61837-1:1999-12: a) All clauses have been revised in accordance with the current requirements for shape and design while taking into account the entire content of the previous edition. b) Enclosure type SIP-L5/01 has been deleted. c) The configuration symbols of the enclosures have been consolidated into one as DCC (dual chip carrier). The responsible committee is K 642 "Piezoelektrische Bauteile zur Frequenzstabilisierung und -selektion" ("Piezoelectric and dielectric devices for frequency control and selection") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
Document: references other documents
Responsible national committee
DKE/K 642 - Piezoelektrische Bauteile zur Frequenzstabilisierung und -selektion