Overview

If micro-electromechanical devices are manufactured by a forming process such as imprinting, it is necessary to predict the material failure in order to increase the reliability of the components. Through this prediction, the effectiveness of manufacturing MEMS components by a forming process can also be improved, because the period of developing a product can be reduced and manufacturing costs can thus be decreased. This document describes one of the prediction methods for material failure during an imprinting process. Definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 µm to 300 µm are defined. The forming limit diagram is determined by submitting the film material to tensile strain with a hemispherical punch. This process is continued until rupture failure of the film material occurs. The metallic film materials described herein are typically used in electric components, MEMS and micro-devices.

Document: references other documents

Responsible national committee

DKE/K 631 - Halbleiterbauelemente