Overview

The main structural materials for micro-electromechanical devices, micromachines, and so on, have special features, such as typical dimensions of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machining, including photolithography. Thin film materials are the main structural materials for micro-electromechanical devices (MEMS), micromachines and similar machines. This part of the DIN EN 62047 standard series specifies a micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. The test piece is a cylindrical pillar fabricated on a rigid (or highly stiff) substrate by micromachining technologies, and its aspect ratio (ratio of pillar diameter to pillar height) should be more than 3. This standard is applicable to metallic, ceramic, and polymeric materials. The responsible committee is K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.

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Responsible national committee

DKE/K 631 - Halbleiterbauelemente