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Hydrogen Technologies Standards form the basic framework for market ramp-up
More information
Climate change Standards and specifications support climate targets
More information
Smart Farming Standards and specifications are drivers for the digitalization of agriculture
More information

Standards [CURRENT]

NF C96-013-6-19 ; NF EN 60191-6-19:2010-11-01
Mechanical standardization of semiconductor devices - Part 6-19 : measurement methods of package warpage at elevated temperature and the maximum permissible warpage

Title (German)

Mechanische Normung von Halbleiterbauelementen - Teil 6-19 : Messverfahren für die Gehäuse-Verbiegung bei erhöhter Temperatur und die maximal zulässige Verbiegung

Edition 2010-11-01

Original language French

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Hydrogen Technologies Standards form the basic framework for market ramp-up

Climate change Standards and specifications support climate targets

Smart Farming Standards and specifications are drivers for the digitalization of agriculture

NF C96-013-6-19 ; NF EN 60191-6-19:2010-11-01 Mechanical standardization of semiconductor devices - Part 6-19 : measurement methods of package warpage at elevated temperature and the maximum permissible warpage

Want to learn more?

NF C96-013-6-19 ; NF EN 60191-6-19:2010-11-01
Mechanical standardization of semiconductor devices - Part 6-19 : measurement methods of package warpage at elevated temperature and the maximum permissible warpage