DIN EN 60749-19
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 19: Prüfung der Chip-Bondfestigkeit (IEC 60749-19:2003 + A1:2010); Deutsche Fassung EN 60749-19:2003 + A1:2010
Overview
This part of DIN EN 60749 is intended for evaluation of integrity of materials and the process steps used to attach semiconductor-dies on package headers or other substrates (carrier tapes). In general, this test method is only applicable to components with a cavity and as a process monitor. It is not applicable to chip sizes of >10 mm2. It is also not applicable to flip-chip technology or flexible substrates. With respect to DIN EN 60749-19:2003-10, a second note in accordance with EN 60749-19/A1:2010-09 was added in clause 1, explaining the differences in the application of packages without cavity and packages with cavity. The responsible Committee is K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
