Overview

This part of IEC 61191 specifies the evaluation criteria for voids with regards to the thermal cycle life and the measurement method of voids using X-ray observation. This part of IEC 61191 applies to voids generated in soldered joints of BGA package and LGA package, when it is mounted on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board. This standard is also applicable, in addition to BGA and LGA, to devices with joints made by melt and re-solidification, such as flip chip devices and multi chip modules. The standard is not applicable to joints with under-fill between a device and a board, or to solder joints within a device package. This standard is applicable to voids of the sizes from 10 micrometers to several hundred micrometers generated in a soldering process, but is not applicable to voids with a size smaller than 10 micrometers in diameter (typically flat microvoids). The responsible Committee is K 682 "Montageverfahren für elektronische Baugruppen" ("Electronics assembly technology") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.

Document: references other documents

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen