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Standards [CURRENT]

BS EN 60191-6-19
Mechanical standardization of semiconductor devices. Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Title (German)

Mechanische Normung von Halbleiterbauelementen. Messverfahren für die Gehäuse-Verbiegung bei erhöhter Temperatur und die maximal zulässige Verbiegung

Edition 2010-06-30
Original language English
Price from 192.70 €
Table of contents