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Standards [CURRENT]

NF C96-022-20-1 ; NF EN 60749-20-1:2009-07-01
Semiconductor devices - Mechanical and climatic test methods - Part 20-1 : handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Title (German)

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20-1 : Handhabung, Verpackung, Kennzeichnung und Transport oberflächenmontierbarer Bauelemente, die empfindlich gegen die Kombination von Feuchte und Lötwärme sind

Edition 2009-07-01
Original language French
Price from 118.70 €
Table of contents