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Standards [CURRENT]

DIN EN 60749-20-1
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-20-1:2009

Title (German)

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20-1: Handhabung, Verpackung, Kennzeichnung und Transport oberflächenmontierbarer Bauelemente, die empfindlich gegen die Kombination von Feuchte und Lötwärme sind (IEC 60749-20-1:2009); Deutsche Fassung EN 60749-20-1:2009

Document: references other documents

Document: referenced in other documents

Responsible national committee

DKE/K 631 - Halbleiterbauelemente

Responsible international committee

IEC/TC 47 - Semiconductor devices

Edition 2009-10

Original language German

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Table of contents

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