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Hydrogen Technologies Standards form the basic framework for market ramp-up
More information
Climate change Standards and specifications support climate targets
More information
Smart Farming Standards and specifications are drivers for the digitalization of agriculture
More information

Pre-standard

BS DD IEC/PAS 61249-3-1
Materials for printed boards and other interconnecting structures. Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

Title (German)

Materialien für Leiterplatten und andere Verbindungsstrukturen. Kupferkaschierte Laminate für flexible Leiterplatten (Ausführungen mit und ohne Kleber-Zwischenschicht)

Edition 2007-10-31

Original language English

Price from 267.20 €

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Hydrogen Technologies Standards form the basic framework for market ramp-up

Climate change Standards and specifications support climate targets

Smart Farming Standards and specifications are drivers for the digitalization of agriculture

BS DD IEC/PAS 61249-3-1 Materials for printed boards and other interconnecting structures. Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

Want to learn more?

BS DD IEC/PAS 61249-3-1
Materials for printed boards and other interconnecting structures. Copper-clad laminates for flexible boards (adhesive and non-adhesive types)