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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Climate change Standards and specifications support climate targets
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Smart Farming Standards and specifications are drivers for the digitalization of agriculture
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Projects of DKE/K 682

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IEC 91/806/NP	2008-08-29	Future IEC 61189-2-719 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-716: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (500MHz to 10GHz) More	Comment
IEC 91/807/NP	2008-08-29	Future IEC 61189-2-720 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (1MHz) More	Comment
IEC 91/804/DC	2008-08-29	Review of 91/761/DC: "How to advance the PT 62468 document" More	Comment
IEC 107/92/DC	2008-07-25	Proposal to expand the title and scope of TC 107 More	Comment
IEC 91/924/CDV	2008-07-25	IEC62137-3 Ed.1: Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints More	Comment
IEC 91/860/CD	2008-04-18	(Future IEC 61188-8-1): Component shape data specification for CAD library - Part 8-1 Generic Descriptions of the 2D and 3D description More	Comment
IEC 91/761/DC	2008-04-11	Proposal on "How to advance the PT 62468 document" - The marking for the presence and absence of the specified chemical substances in materials, components and mounted boards used in electrical and electronic equipment More	Comment
IEC 91/754/NP	2008-03-07	(Future IEC 61249-2-27): Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad More	Comment
IEC 91/755/NP	2008-03-07	(Future IEC 61249-2-30): Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad More	Comment
IEC 91/756/NP	2008-03-07	(Future IEC 61249-2-39): Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - Modified epoxide and non-epoxide, woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly More	Comment

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