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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Climate change Standards and specifications support climate targets
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Smart Farming Standards and specifications are drivers for the digitalization of agriculture
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Projects of DKE/K 682

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IEC 91/877/DC	2009-07-03	Maintenance - Call for comments/proposals for the revision of IEC 60194 Ed. 5.0, and call for experts for maintenance team More	Comment
IEC 107/105/DC	2009-06-12	Maintenance of IEC/TR 62240: Process management for avionics - Use of semiconductor devices outside manufacturers' specified temperature range More	Comment
IEC 91/869/DC	2009-05-29	Maintenance - Call for comments / proposals for amendment / revision on IEC 61191-1 Ed. 1.0 and IEC 61191-2 Ed. 1.0, and call for experts for maintenance team More	Comment
IEC 91/870/DC	2009-05-29	Maintenance - Call for comments / proposals for amendment / revision on IEC 61192-1 Ed. 1.0 and IEC 61192-2 Ed. 1.0, and call for experts for maintenance team More	Comment
IEC 91/848/DC	2009-02-06	Maintenance of IEC 60068-2-82 Ed. 1.0: ENVIRONMENTAL TESTING - Part 2-82: Tests - Test Tx: Whisker test methods for electronic and electric components More	Comment
IEC 91/903/CDV	2009-01-30	IEC 60068-2-83 Ed.1: Environmental Testing - Part 2-83: Tests-test Tf: Solderability testing of electronic components forsurface mounting devices (SMD) by the wetting balance method using solder paste More	Comment
IEC 91/905/CDV	2008-11-07	IEC 61182-2-2: Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description More	Comment
IEC 91/969/CD	2008-10-10	IEC 61189-11 Ed.1: Test methods for electrical materials,interconnection structures and assemblies - Part 11: Measurement of melting temperature and melting temperature ranges of solder alloys More	Comment
IEC 91/800A/DC	2008-09-19	Proposal for Amendment to IEC 61190-1-3 Ed. 2 (Lead-free solder alloys) - Additional information and extension of closing date from 2008-09-26 to 2008-10-03 More	Comment
IEC 91/805/NP	2008-08-29	Future IEC 61189-2-628 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-628: Mechanical test methods for printed board and assembly materials - Glass transition temperature of base material by dynamic mechanical analysis (DMA; bend and pull) More	Comment

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