We use cookies to make our website more user-friendly and to continually improve it. Please agree to the use of cookies in order to proceed with using our websites. More information can be found in our data protection information and our cookie guidelines.

- Required
- Functional
- Personalization
- Required
  These cookies are essential for the operation of the site and enable, for example, security-relevant functions. In addition, we can also use this type of cookie to determine whether you want to remain logged in to your profile in order to make our services available to you more quickly when you visit our website again.
- Functional
  In order to further improve our offer and our website, we collect anonymized data for statistics and analysis. With the help of these cookies we can, for example, determine the number of visitors and the effect of certain pages on our website and optimize our content.
- Personalization
  We use these cookies to make it easier for you to use the site. For example, based on a previous (e.g. product search), you can conveniently access it when you visit our website again.

Attention: Your browser doesn't support javascript or you have deactivated Javascript in your browser. Please enable Javascript in your browser in order to be able to use all functions of this website.

Hydrogen Technologies Standards form the basic framework for market ramp-up
More information
Climate change Standards and specifications support climate targets
More information
Smart Farming Standards and specifications are drivers for the digitalization of agriculture
More information

Projects of DKE/K 682

Sort by:


IEC 91/995/CD	2011-08-26	IEC 62326-15: Printed boards - Device Embedded Substrate - General electrical test guide for device embedded substrate with active devices, passive components (Capacitor, Resistor, Inductor, etc), Integrated passive device (IPD), and discrete packages. More	Comment
IEC 91/987/CD	2011-07-15	Test method for erosion of wave soldering equipments by molten lead free solder alloy-Part 1: Erosion test method for the metallic material without surface treatment More	Comment
IEC 91/965/NP	2011-02-18	Future IEC 61760-4 Ed.1: Classification, packaging, labelling and handling of moisture sensitive devices More	Comment
IEC 91/968/NP	2011-02-18	Test method for erosion by molten lead free solder. More	Comment
IEC 107/145/CD	2011-01-21	IEC 62239-1 TS Ed.1: Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan More	Comment
IEC 107/146/CD	2011-01-21	IEC 62668-1 TS Ed.1: Process management for avionics - Counterfeiting prevention - Part 1: Guidelines for avoiding the use of counterfeited, fraudulent and recycled electronic components More	Comment
IEC 91/952/DC	2010-10-01	Review and Maintenance - call for comments/ proposals onpublications coming up for review and a call for experts More	Comment
IEC 91/972/CDV	2010-09-24	IEC 61249-4-18: Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly More	Comment
IEC 91/973/CDV	2010-09-24	IEC 61249-4-19: Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly More	Comment
IEC 91/1004/CDV	2010-08-06	IEC 60194 Ed.6: Printed board design, manufacture and assembly - Terms and definitions More	Comment

5 / 17

TOP

Want to learn more?

Show

Preferred form of address

Male

Female

Neutral

First name*

Last name*

E-mail*

Phone no.

Subject

???din.label.contact.mailSubject???

Message*

Security code*

Here you can find our privacy policy

*Required field