• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Projects of DKE/K 682

DIN EN IEC 61189-2-809 2021-08-05 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (IEC 91/1747/CD:2021); Text in German and English More  Comment 
DIN EN IEC 61188-6-3 2021-01-06 Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021); Text in German and English More  Comment 
DIN EN IEC 61189-2-805 2021-01-05 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA (IEC 91/1696/CD:2020); Text in German and English More  Comment 
DIN EN IEC 61189-2-808 2020-12-10 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English More  Comment 
DIN EN IEC 63215-2 2020-10-12 Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices (IEC 63215-2:2023); German version EN IEC 63215-2:2023 More  Comment 
IEC 40/2196/CD 2013-01-25 IEC 60286-2 Ed.4: Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes More  Comment 
IEC 91/1083/CD 2013-01-25 IEC 62326-18 Ed.1: Printed boards - Part 18: Standard on Device Embedded Substrate - Test methods More  Comment 
IEC 107/197/CDV 2012-11-30 IEC 62396-3 Ed.1: Process management for avionics - Atmospheric radiation effects - Part 3: Optimising system design to accommodate the single event effects (SEE) of atmospheric radiation More  Comment 
IEC 91/1047/CD 2012-08-24 IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More  Comment 
IEC 91/1049/CD 2012-08-24 IEC 62326-15: Printed boards - Part 15: Device Embedded Substrate - General electrical test guide for device embedded substrate with active devices, passive components (Capacitor, Resistor, Inductor, etc), Integrated passive device (IPD), and discrete packages More  Comment 

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