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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Climate change Standards and specifications support climate targets
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Smart Farming Standards and specifications are drivers for the digitalization of agriculture
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Projects of DKE/K 682

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IEC 91/433/NP	2003-10-17	IEC xxx-xx: Test methods for lead-free solder - Part 2: Testing of mechanical characteristics More	Comment
IEC 91/407/NP	2003-07-11	IEC 61188-5-7 Design and use of printed boards and printed board assemblies - Part 5-7: Sectional requirements attachment (land/joint) considerations - components with post mounting leads on two sides (dips) More	Comment
IEC 91/405/NP	2003-07-11	IEC 61249-1-1: Materials for printed boards and other interconnection structures - Part 1-1: Safety certification of base materials for rigid printed circuit boards More	Comment
IEC 91/378/NP	2003-03-07	IEC 61190-1-6: Attachment materials for electronic assembly - Part-1-6: Requirements for electronic grade lead free solder alloys and fluxed and non-fluxed lead free solid solder for electronic soldering applications More	Comment
IEC 91/379/NP	2003-03-07	IEC 61190-1-7: Attachment materials for electronic assembly - Part-1-7: Requirements for lead free solder pastes for high quality interconnections in electronics assembly More	Comment
IEC 107/18/CD	2002-01-18	Process Management for Avionics - Technical Specification for Preparing an Electronic Components Management Plan More	Comment
IEC 91/393/CD	2001-10-26	IEC 61249-6-3, Ed.1: Materials for interconnection structures - Part 6-3: Sectional specification for reinforcements - Woven fibreglass fabrics More	Comment
IEC 91/247/CDV	2001-06-29	IEC 61249-4-1 Ed.1: Materials for printed boards and other interconnecting structures - Part 4: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Section 1: Epoxide woven E-glass prepreg of defined flam More	Comment
IEC 91/245/NP	2001-06-22	Printed wiring boards - Part XX: Guide to the rework of unassembled boards More	Comment
IEC 91/246/NP	2001-06-22	Printed wiring boards - Part XX: Guide to the rework and repair of soldered surface mounted printed board assemblies More	Comment

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