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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Smart Farming Standards and specifications are drivers for the digitalization of agriculture
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IEC 91/530/NP	2005-06-24	Surface mounting technology - Environmental and endurance test methods for surface mount solder joint. Part 3: Cyclic drop test More	Comment
IEC 91/531/NP	2005-06-24	The marking for presence and non-presence of the specified chemical substance in materials, components and mounted boards use in electrical and electronic equipment More	Comment
IEC 91/532/NP	2005-06-24	Environmental Testing - Part X: Tests - Test: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste More	Comment
IEC 107/29/CD	2004-11-12	Process management for avionics industry - Standard for the accommodation of atmospheric radiation effects via single event effects within avionics electronic equipment (IEC 107/29/CD:2004) More	Comment
IEC 91/486/NP	2004-09-10	Detail Specification for Right-angled Optical Board Connector using Glass Fibers More	Comment
IEC 91/476/NP	2004-08-20	Marking, Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies, Components and Devices More	Comment
IEC 91/469/NP	2004-07-02	Specification for Flexible Optical Board using Glass Fibre and its test methods More	Comment
IEC 91/470/NP	2004-07-02	Specification for rigid optical board using planar waveguide and its test methods More	Comment
IEC 91/471/NP	2004-07-02	Specification for optical board connector type SF using glass fibre More	Comment
IEC 91/432/NP	2003-10-17	IEC xxx-xx: Test methods for lead-free solders - Part 1: Measurement of melting temperature ranges More	Comment

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