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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Climate change Standards and specifications support climate targets
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Smart Farming Standards and specifications are drivers for the digitalization of agriculture
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Projects of DKE/K 682

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IEC 91/598/NP	2006-04-28	IEC 61249-2-38: Materials for printed boards and other interconnecting structures - Part 2-38: Sectional specification set for reinforced based materials, clad and unclad - Non-halogenated epoxide woven glass fabric copper-clad sheet of defined flammability for lead-free assembly More	Comment
IEC 91/597/NP	2006-04-28	IEC 61249-2-37: Materials for printed boards and other interconnecting structures - Part 2-37: Sectional specification set for reinforced based materials, clad and unclad - Multi-functional, non-halogenated epoxide woven glass fabric copper-clad sheet of defined flammability for lead-free assembly More	Comment
IEC 40/1740/NP	2006-04-14	Packing of components for automatic handling - Part 3: Type VI: Packing of surface mount components on blister carrier tapes 4 mm in width More	Comment
IEC 40/1708/CD	2006-02-10	IEC 60286-3: Packing of components for automatic handling - Part 3: Type V : Packing of surface mount components on continuous pressed carrier tapes More	Comment
IEC 91/575/NP	2005-12-16	Future IEC 61193-3: Quality Assessment Systems - Part 3: Selection and use of sampling plans for Printed Board and Laminate end-product and in-process auditing More	Comment
IEC 91/565/DC	2005-10-14	Publication Plan of future IEC 61249-2-27, 2-28, 2-29, 2-30, 2-31, 2-32, 2-33, 2-34 and 2-35 More	Comment
IEC 91/563/NP	2005-10-07	Future IEC 61249-2-35: Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly More	Comment
IEC 91/554/CD	2005-09-02	IEC 60068-2-20 Ed. 5: Basic environmental testing procedures: Part 2: Tests - Test T: Test methods for solderability and resistance to soldering heat of leaded devices More	Comment
IEC 40/1605/NP	2005-08-26	IEC 60286-3-X: Packaging of components for automatic handling Part X: Packaging of surface mount components on continuous press carrier tapes More	Comment
IEC 107/45/DC	2005-06-24	Lead-free electronics in aerospace More	Comment

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