• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Projects of DKE/K 682

IEC 40/1785/CDV 2006-09-22 IEC 60286-3-V: Packaging of components for automatic handling - Part 3, Type V : Packaging of surface mount components on continuous pressed carrier tapes More  Comment 
IEC 91/615/NP 2006-07-21 Proposal of the JPNC: NP-PAS - Performance guide for single- and double-sided flexible printed wiring boards More  Comment 
IEC 91/616/NP 2006-07-21 Proposal of the JPNC: NP-PAS - Copper-Clad Laminate for Flexible Printed Wiring Boards (Adhesive and Non-adhesive types) More  Comment 
IEC 91/642/CDV 2006-07-14 IEC 62468 Ed.1 : The marking for the presence and absence of the specified chemical substances in materials, components and mounted boards used in electrical and electronic equipment More  Comment 
IEC 91/663/CDV 2006-04-28 NP-CDV: IEC 61249-4-14, Ed. 1: Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly More  Comment 
IEC 107/54/NP 2006-04-28 Process management for avionics - Guide for defining and performing highly accelerated tests in avionic systems (IEC/PAS) More  Comment 
IEC 91/592/NP 2006-04-28 IEC 61249-4-15: Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability for lead-free compatible assembly More  Comment 
IEC 91/594/NP 2006-04-28 IEC 61249-4-16: Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability for lead-free compatible assembly More  Comment 
IEC 91/595/NP 2006-04-28 IEC 61249-4-17: Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability for lead-free compatible assembly More  Comment 
IEC 91/596/NP 2006-04-28 IEC 61249-2-36: Materials for printed boards and other interconnecting structures - Part 2-36: Sectional specification set for reinforced based materials, clad and unclad - Epoxide woven glass fabric copper-clad sheet of defined flammability for lead-free assembly More  Comment 

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