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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Climate change Standards and specifications support climate targets
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Smart Farming Standards and specifications are drivers for the digitalization of agriculture
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Projects of DKE/UK 631.4

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IEC 47D/201/CDV	1996-04-05	IEC 60191-2: Proposal for a plastic thin shrink small outline package (TSSOP/HTSSOP), 1,00 mm lead length outline family, R-PDSO-G More	Comment
IEC 47D/283/FDIS	1995-09-22	IEC 60191-2: Plastic small outline family, J-leads (P-SOJ), 10,16 mm body family (to be published as outline 141E-d) More	Comment
IEC 47D/284/FDIS	1995-09-22	IEC 60191-2: Plastic thin small outline package P-TSOP-II, 7,62 mm body family More	Comment
IEC 47D/285/FDIS	1995-09-22	IEC 60191-2: P-TSOP-II, 10,16 mm body family (if approved, to be included in outline 139E) More	Comment
IEC 47D/286/FDIS	1995-09-08	IEC 60191-2: HSOP, reverse bend, heatslug up More	Comment
IEC 47D/107/FDIS		IEC 191-5: Mechanical standardization of semiconductor devices - Part 5: Recommendations applaying to integrated circuit packages using tape automated bonding (TAB) More	Comment

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